Vantron VT-MOB-AH-8108 Wi-Fi HaLow Module

The Vantron VT-MOB-AH-8108 Wi-Fi HaLow Module features Morse Micro’s MM8108 SoC to provide long-range, low-power wireless connectivity compliant with IEEE 802.11ah. Packaged in LGA form, it operates in sub-1GHz license-exempt bands, ideal for industrial and IoT environments.
 
It supports data rates up to 43.3 Mbps over 8MHz bandwidth with USB 2.0 and SDIO/SPI interfaces, offering station and access point modes. Security includes WPA3 and hardware encryption. The module performs reliably across -40°C to 85°C and integrates power amplifier, low-noise amplifier, and T/R switch components.
 
Designed for industrial IoT, smart agriculture, and wide sensor networks, it offers a compact, secure, and flexible solution for embedded applications in challenging settings.
 
Key features
Powered by Morse Micro MM8108 chipset
Land Grid Array (LGA) packaging
Up to 43.33 Mbps data rates@8MHz
Host Interface options: USB 2.0, SDIO, SPI
Small Footprint: Dimensions 11×10×2.28mm
Worldwide Sub-1 GHz frequency bands : 850MHz~950 MHz
Channel bandwidth options: 1/2/4/8 MHz
AES, Hardware support for SHA1 and SHA2, WPA3 support
VBAT: 3.3V, VDDIO: 3.3V
Operating temperature: -40℃ ~ 85℃
 
Specifications
Major Chipset: Morse Micro MM8108 HaLow SoC
Host interface: 1 x USB 2.0 (Device); 1 x 1-bit/4-bit SDIO (combo with SPI)
GPIO: 13 x GPIO
JTAG: Supported
Wi-Fi standard: IEEE 802.11ah
Frequency range (Sub 1 GHz bands): 850MHz ~ 950MHz
Channel bandwidth: 1 / 2 / 4 /8MHz
Data rate* (256-QAM): 1MHz: 4.44Mbps (Max.); 2MHz: 8.67Mbps (Max.); 4MHz: 20Mbps (Max.); 8MHz: 43.3Mbps (Max.)
Security: AES encryption engine; SHA1 and SHA2 hash algorithms (SHA-256, SHA-384, SHA-512); WPA3; Protected management frames (PMF); Opportunistic Wireless Encryption (OWE).
Dimensions: 11mm x 10mm x 2.28mm
Power: 3.3V/1A DC input
Temperature: Operating: -40℃~+85℃; Storage: -40℃~+85℃
Humidity: Less than 85% (Non-condensing)
Packaging: LGA
Certification: CE, FCC, UL