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SKU: EXMP-Q911

Innodisk EXMP-Q911 COM-HPC Mini Module

Antal

The Innodisk EXMP-Q911 COM-HPC Mini Module features the Qualcomm Dragonwing QCS9075 SoC with an octa-core Kryo Gen 6 CPU, Adreno 663 GPU, and dual Hexagon Tensor Processors delivering up to 100 TOPS dense and 200 TOPS sparse AI performance. It includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage for demanding AI workloads.

 

This module supports PCIe Gen4 expansion, dual 2.5GbE LAN, dual four-lane MIPI CSI-2, multiple display outputs, USB, UART, CAN FD, SPI, I²S, and GPIO interfaces. It is hardened for industrial temperatures and designed for embedded AI applications requiring reliable, scalable connectivity.

 

Ideal for industrial automation, edge AI, IoT, and transportation, it supports Yocto Linux and Ubuntu with chipset longevity until 2038, ensuring integrated long-term deployment.

 

Order Information

  • EXMP-Q911-00A1-W1: COM-HPC Mini Module, Qualcomm IQ9075, 36GB RAM, 128GB UFS, 100 TOPS, 8 ~ 20V DC, -40°C ~ 85°C, 95 x 70mm

 

Key Features

  • Powered by Qualcomm Dragonwing QCS9075
  • Provides up to 100 TOPS of AI processing performance at low power with Hexagon NPU
  • Accelerates AGV, AMR, and LLM applications at the edge with unparalleled performance
  • 128GB UFS 3.1 storage, up to 36GB onboard memory
  • Dual 2.5G Ethernet, dual 4-lane MIPI CSI-2
  • COM-HPC Mini form factor
  • Longevity: Chipset supported through 2038

 

Specifications

  • Module Form Factor: COM-HPC Mini
  • CPU: QCS9075 (Octa-core Kryo Gen 6 : 8x Kryo Gold Prime @2.36GHz)
  • Graphics: Adreno 663 GPU
  • Memory: 36GB LPDDR5X
  • Storage: 128GB UFS 3.1
  • AI Engine: 100 TOPS (Dense) / 200 TOPS (Sparse) via 2 x Hexagon Tensor Processor
  • Expansion: 1 x PCIe Gen 4 x4; 1 x PCIe Gen 4 x2
  • MIPI: 2 x 4-lane MIPI CSI-2 (22pin, P: 0.5, on module)
  • Ethernet: 2 x RJ45 2.5 GbE LAN
  • Display: 2 x DP1.2; 1 x eDP
  • Audio: 1 x I²S for Headphone / AMP
  • I/O: 2 x USB 3.2 Gen 2 x1 (10Gbps); 4 x USB 2.0; 2 x UART (1 with CTS / RTS); 1 x COM (RS232 / 422 / 485, on module); 1 x SPI (General SPI); 1 x CAN FD; 4 x I²S (1 x on module, 3.3V); 12 x GPIO; 1 x RTC
  • Power Requirement: 8 ~ 20V DC Power Supply
  • Security: TPM 2.0
  • OS Support: Yocto Linux; Ubuntu
  • Other Features: RTC: External; Watchdog Timer: Programmable watchdog to protect the system from crashes; Fan Supply: PWM Speed Control for System Fan on Carrier Board; System Monitoring: CPU Temperature, CPU Fan
  • Temperature: Operating: -40°C ~ 85°C (Ta); Storage: -40°C ~ 95°C (Ta)
  • Humidity: Operating & Storage: 5% to 95%, Non-condensing
  • Vibration: 3G, IEC 60068-2-64, Random Vibration, 5 ~ 500Hz, 1hr/axis
  • Shock: 30G, IEC 60068-2-27, Halfcapt_CONNECTED Sinus, 11ms Duration
  • ESD: EN61000-4-2, Air-15kV, Contact-8kV
  • Certification: CE / FCC Class B
  • Warranty: 2 Years
  • Weight (g): 53.3
  • Dimensions (W x L/mm): 95 x 70mm

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