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SKU: EXEC-Q911

Innodisk EXEC-Q911 COM-HPC Mini Starter Kit

Antal

The Innodisk EXEC-Q911 COM-HPC Mini Starter Kit includes a COM-HPC Mini Module with Qualcomm Dragonwing IQ-9075 SoC and carrier board, designed for embedded systems and industrial automation. It delivers AI computing with low power consumption and long-term chipset availability through 2038.

 

Equipped with 36GB LPDDR5X, 128GB UFS 3.1 storage, dual 2.5GbE LAN, and dual 4-lane MIPI CSI-2, it supports PCIe Gen4, USB 3.2 Gen 2, CAN FD, and GPIO for broad connectivity. The industrial-grade module operates from -40°C to 85°C for reliable deployment.

 

This compact kit suits edge AI, industrial IoT, and vision computing applications requiring scalable AI inference and versatile expansion, aiding developers and OEMs in fast prototyping and integration within constrained spaces.

 

Order Information

  • EXEC-Q911-00A1-W1: COM-HPC Mini Starter Kit, Qualcomm IQ-9075, 128G UFS, 36G LPDDR5, DC 9-36V, -40 ~85°C

 

Key Features

  • Powered by Qualcomm Dragonwing QCS9075
  • Provides up to 100 TOPS of AI processing performance at low power
  • Accelerates AGV, AMR, and LLM applications at the edge with unparalleled performance
  • 128GB UFS 3.1 storage, up to 36GB onboard memory
  • Dual 2.5G Ethernet, dual 4-lane MIPI CSI-2
  • Longevity: Chipset supported through 2038

 

Specifications

System

  • Model Name: EXEC-Q911
  • Module Form Factor: COM-HPC Mini
  • CPU: Qualcomm Dragonwing IQ-9075 SoC (Octa-core Kyro Gen 6 : 8x Kryo Gold Prime @2.36GHz)
  • Graphics: Adreno 663 GPU
  • Memory: 36GB LPDDR5X
  • Storage: 128GB UFS 3.1
  • AI Engine: 100 TOPS (Dense) / 200 TOPS (Sparse) via 2 x NPU Hexagon Tensor Processor

Expansion Slots

  • M.2 2280 M Key: 1 x PCIe Gen 4 x4
  • M.2 3052 B Key: USB 3.2 Gen 2, USB2.0*
  • M.2 2230 E Key: 1 x PCIe Gen 4 x2, USB 2.0

MIPI

  • MIPI CSI-2: 2 x 4-lane MIPI CSI-2 (22pin, P : 0.5, on module)

Ethernet

  • LAN: 2 x 2.5GbE RJ45

Display

  • DP1.2: 2
  • eDP: 1

Audio

  • MIC In / LINE Out: Phone Jack 3.5mm
  • AMP Out: Wafer (1 x 4)

External I/O

  • USB 3.2 Gen 2 x1 (10Gbps): 3
  • USB 3.2 Gen 2 x1 (10Gbps) Type-C: 1 (OTG support)*
  • USB 2.0: 2
  • Buttons: 1 x Power, 1 x Reset
  • Power Connector: Pluggable Terminal Block, P: 5.08mm, female, 2pin

Internal I/O

  • Debug Port (UART): 1 (1 x 3, P : 2.54, 3.3V)
  • EDL Jumper: 1 (1 x 3, P : 2.0)
  • CPU Fan Connector: 1 (1 x 4, P : 2.54, for PWM Contorl, 12V)
  • eDP: 1 (40pin, P : 0.5)
  • eDP Power Jumper: 1 (2 x 3, P : 2.0)
  • GMSL Power: 1 (1 x 4, P: 2.0, 12V 3A)
  • GPIO: 8 (1 x 10, P : 1.0, 0.5A VCC, GND)
  • SPI: 1 (1 x General SPI on 12-pin header, P:2.0, 3.3V)*
  • I2C: 2 (1 x I2C on module, P:1.0, 3.3V ; 1 x I2C on 12-pin header, P:2.0)*
  • CAN FD: 1 (1 x 3, P : 2.0)
  • COM: 2 (1 x 9 P : 1.0, on module, 1 x 9 P : 1.0, on carrier board, RS232 / 422 / 485)*
  • USB 2.0: 1 (1 x 8, P : 1.0)*
  • Boot Mode Select: 1 (Toggle Switch, 4 Poles)*
  • Sim Slot: Nano SIM (4FF)*

Power

  • Power Input Voltage: DC 9-36V (12V@2.6A)
  • RTC Battery: CR2302 Coin Cell

Security

  • TPM2.0

OS Support

  • Yocto Linux (Kernel 6.6)
  • Ubuntu 24.04 (Kernel 6.8)

Other Features

  • Watchdog Timer: Programmable watchdog to protect the system from crashes
  • Fan Supply: PWM Speed Control for CPU Fan on Carrier Board
  • System Monitoring: CPU Temperature, CPU Fan, Module Voltage, Current

Environment

  • Temperature: Operating: -40°C ~ 85°C (Ta); Storage: -40°C ~ 95°C (Ta)
  • Humidity: Operating & Storage: 5% to 95%, Non-condensing
  • Vibration (Operating): 3G, IEC 60068-2-64, Random Vibration, 5 ~ 500Hz, 1hr/axis
  • Shock (Operating): 30G, IEC 60068-2-27, Half Sine, 11ms Duration
  • ESD: EN61000-4-2, Air-15kV, Contact-8kV

Certification

  • CE / FCC Class B

Weight

  • Net Weight (g): 1704
  • Gross Weight (g): TBD

Dimensions (L x W x H)

  • 146 x 102 x 56.99 mm

Note

  • * Indicates that the specifications differ from the EVT-stage design.

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