Vantron VT-MOB-AH-L Wi-Fi HaLow Module

The Vantron VT-MOB-AH-L Wi-Fi HaLow Module features the Morse Micro MM6108 SoC in an LGA package, delivering sub-1 GHz wireless connectivity compliant with IEEE 802.11ah. It supports channel bandwidths from 1 to 8 MHz, enabling data rates up to 32.5 Mbps, optimized for low-power, long-range IoT communications.
 
With SDIO 2.0 and SPI interfaces and support for station and access point modes, it includes WPA3 security and SHA1/SHA2 hashing with AES encryption. Industrial-grade specs ensure dependable performance across -40°C to +85°C and meet FCC, CE, and IC certifications.
 
Designed for integration in industrial automation, smart infrastructure, and edge IoT, the module offers GPIO and JTAG flexibility for OEMs developing scalable, secure, long-range wireless solutions.
 
Key features
Single-stream data rate up to 32.5 Mbps @8MHz or 15 Mbps @4MHz channel bandwidth
IEEE Std 802.11ah-2016 compliant
Automatic frequency and gain control
Support both STA and AP modes
Host interface SDIO 2.0 /SPI
BPSK & QPSK, 16-QAM & 64-QAM Modulation
 
Specifications
Major Chipset: Morse Micro MM6108 HaLow SoC
Host interface: 1 x SDIO/SPI
GPIO: 9 x GPIO
JTAG: Supported
Wi-Fi standard: IEEE 802.11ah
Frequency range (Sub 1 GHz bands): 850MHz ~ 950MHz
Channel bandwidth: 1 / 2 / 4 /8 MHz
Data rate: 1 MHz/3.33Mbps (Max.), 2 MHz/7.22Mbps (Max.), 4 MHz/15Mbps (Max.), 8 MHz/32.5Mbps (Max.)
Security: AES encryption engineSHA1 and SHA2 hash algorithms (SHA-256, SHA-384, SHA-512)WPA3 including protected management frames (PMF)
Dimensions: 18.5mm x 14mm x 2.1mm
Voltage: VBAT: 3.3V, VDD_FEM: 3.3V, VDDIO: 3.3V
Temperature: Operating: -40℃~+85℃ /Storage: -40℃~+90℃
Humidity: Less than 85% (Non-condensing)
Packaging: LGA
Certificate: FCC, IC, CE